september 2008 rev 6 1/9 9 stps2150 power schottky rectifier features negligible switching losses low forward voltage drop for higher efficiency and extented battery life low thermal resistance surface mount miniature package avalanche capability specified description 150 v power schottky rectifiers are suited for switch mode power supplies on up to 24 v rails and high frequency converters. packaged in sma, sma low profile, and axial, this device is intended for use in consumer and computer applications like tv, stb, pc and dvd where low drop forward voltage is required to reduce power dissipation. table 1. device summary i f(av) 2 a v rrm 150 v t j (max) 175 c v f (max) 0.67 v k a k a k a sma (jedec do-214ac) stps2150a do-15 stps2150 smaflat (jedec do-221ac) stps2150af www.st.com
characteristics stps2150 2/9 1 characteristics to evaluate the conduction losses use the following equation: p = 0.59 x i f(av) + 0.04 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 150 v i f(av) average forward current sma, smaflat t l = 145 c = 0.5 2 a do-15 t l = 130 c = 0.5 i fsm surge non repetitive forward current sma, smaflat t p = 10 ms sinusoidal 75 a do-15 150 p arm repetitive peak avalanche power tp = 1 s tj = 25 c 2400 w t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) 175 c 1. condition to avoid thermal runaway for a diode on its own heatsink dptot dtj --------------- 1 rth j a ? () ------------------------- - < table 3. thermal resistance symbol parameter value unit r th(j-l) junction to lead sma, smaflat 20 c/w lead length = 10 mm do-15 30 table 4. static electrical characteristics symbol parameter tests conditions min. typ max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 0.5 1.5 a t j = 125 c 0.5 1.5 ma v f (2) forward voltage drop t j = 25 c i f = 2 a 0.78 0.82 v t j = 125 c 0.62 0.67 t j = 25 c i f = 4 a 0.86 0.89 t j = 125 c 0.70 0.75 1. t p = 5 ms, < 2% 2. t p = 380 s, < 2%
stps2150 characteristics 3/9 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) p (w) f(av) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 i (a) f(av) t =tp/t tp = 1 = 0.05 = 0.5 = 0.1 = 0.2 i (a) f(av) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 150 175 r th(j-a) =r th(j-l) t =tp/t tp r th(j-a) =100c/w sma / smaflat do-15 r th(j-a) =200c/w t (c) amb figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t) p (25c) arm j arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values, do-15) figure 6. non repetitive surge peak forward current versus overload duration (maximum values, sma) i (a) m 0 1 2 3 4 5 6 7 8 9 10 1.e-03 1.e-02 1.e-01 1.e+00 t a =25c t a =75c t a =125c i m t =0.5 do-15 t(s) i (a) m 0 1 2 3 4 5 6 7 8 9 10 1.e-03 1.e-02 1.e-01 1.e+00 t a =25c t a =75c t a =125c i m t =0.5 sma t(s)
characteristics stps2150 4/9 figure 7. non repetitive surge peak forward current versus overload duration (maximum values, smaflat) figure 8. relative variation of thermal impedance junction to ambient versus pulse duration (do-15) i(a) m 0 1 2 3 4 5 6 1.e-03 1.e-02 1.e-01 1.e+00 t a =25c t a =75c t a =125c i m t =0.5 smaflat t(s) z/r th(j-a) th(j-a) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 single pulse do-15 t (s) p figure 9. relative variation of thermal impedance junction to ambient versus pulse duration (sma) figure 10. relative variation of thermal impedance junction to ambient versus pulse duration (smaflat) z/r th(j-a) th(j-a) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 single pulse sma t (s) p 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 single pulse smaflat z/r th(j-a) th(j-a) t (s) p figure 11. reverse leakage current versus reverse voltage applied (typical values) figure 12. junction capacitance versus reverse voltage applied (typical values) i (a) r 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 0 25 50 75 100 125 150 t =125c j t =150c j t =100c j t =50c j t =25c j t =75c j v (v) r c(pf) 10 100 1000 1 10 100 1000 v (v) r f=1mhz v =30mv t =25c osc rms j
stps2150 characteristics 5/9 figure 17. thermal resistance versus lead length (do-15) figure 13. forward voltage drop versus forward current (maximum values, low level) figure 14. forward voltage drop versus forward current (maximum values, high level) i (a) fm 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 t j =25c (maximum values) t j =125c (maximum values) t j =125c (maximum values) t j =125c (typical values) t j =125c (typical values) v (v) fm i (a) fm 1 10 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 v (v) fm t =25c (maximum values) j t =125c (maximum values) j t =125c (typical values) j figure 15. thermal resistance junction to ambient versus copper surface under each lead - epoxy printed circuit board fr4, copper thickness = 35 m (sma) figure 16. thermal resistance junction to ambient versus copper surface under each lead - epoxy printed circuit board fr4, copper thickness = 35 m (smaflat) r (c/w) th(j-a) 0 20 40 60 80 100 120 140 012345 sma s (cm2) cu 0 20 40 60 80 100 120 140 160 180 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 smaflat r (c/w) th(j-a) s (cm2) cu r (c/w) th 0 20 40 60 80 100 120 5 10152025 r th(j-a) r th(j-i) l (mm) leads
package information stps2150 6/9 2 package information epoxy meets ul94, v0. in order to meet environmental requirements, st offers these devices in ecopack ? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at www.st.com . table 5. sma package dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.094 a2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 d 2.25 2.90 0.089 0.114 e 4.80 5.35 0.189 0.211 e1 3.95 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 figure 18. sma footprint dimensions in millimeters (inches) figure 19. marking information e c l e1 d a1 a2 b 2.63 (0.103) 5.43 (0.214) 1.4 1.64 (0.064) 1.4 (0.055) (0.055) y w w e3 z x x x e3: ecopack ( leadfree) xxx: marking z: manufacturing location y: year ww: week cathode bar ( unidirectional devices only )
stps2150 package information 7/9 table 6. smaflat dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.10 0.035 0.043 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 d 2.25 2.95 0.088 0.116 e 4.80 5.60 0.189 0.220 e1 3.95 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 l1 0.50 0.019 l2 0.50 0.019 figure 20. smaflat footprint dimensions optimized for smaflat (1) 1. sma footprint may also be used. figure 21. marking information table 7. do-15 package dimensions ref. dimensions millimeters inches min. max. min. max. a 6.05 6.75 0.238 0.266 b 2.95 3.53 0.116 0.139 c 26 31 1.024 1.220 d 0.71 0.88 0.028 0.035 d a l 2x l l2 2x l1 2x e e1 b c 1.20 (0.047) 1.20 (0.047) 3.12 (0.123) 5.52 (0.217) 1.52 (0.060) millimeters (inches) y w w e3 z x x x e3: ecopack ( leadfree) xxx: marking z: manufacturing location y: year ww: week cathode bar ( unidirectional devices only ) a c c d b
ordering information stps2150 8/9 3 ordering information 4 revision history table 8. ordering information order code marking package weight base qty delivery mode stps2150a 2150 sma 0.068 g 5000 tape and reel stps2150 stps2150 do-15 0.4 g 2000 ammopack stps2150rl stps2150 do-15 0.4 g 5000 tape and reel stps2150af f2150 smaflat 0.035 g 1000 tape and reel table 9. document revision history date revision description of changes jul-2003 3a last update. aug-2004 4 sma package dimensions update. reference a1 max. changed from 2.70mm (0.106) to 2.03mm (0.080). 31-may-2006 5 reformatted to current standard. added ecopack statement. updated sma footprint in figure 15. changed nf to pf in figure 10. 18-sep-2008 6 reformatted to current standard. added smaflat package. removed if(rms) from ta bl e 2 .
stps2150 9/9 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorize representative of st, st products are not designed, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems, where failure or malfunction may result in personal injury, death, or severe property or environmental damage. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2008 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
|
